发明名称 PRESSURE-APPLYING DEVICE AND INJECTION MOLDING MACHINE/PRESS MACHINE
摘要 PROBLEM TO BE SOLVED: To provide a pressure-applying device which can obtain large press force by a small linear motor and a driving amplifier, an injection molding machine having the pressure-applying device, and a press machine. SOLUTION: In the pressure-applying device having a pressure receiver 3, a presser 4 pressing the pressure receiver 3, and a needle 2 which is driven by the linear motor and presses/moves the presser 4, a spring 5 is provided between the presser 4 and the needle 2, the needle 2 collides with the spring 5 from a position separated from the spring 5, the spring 5 is compressed by the conversion of the kinetic energy of the needle 2 into the positional energy of the spring 5, and the presser 4 is pressed by the repulsive force of the spring 5. A lock mechanism 6 fixing the needle 2 while the spring 5 is compressed is provided. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005138461(A) 申请公布日期 2005.06.02
申请号 JP20030378239 申请日期 2003.11.07
申请人 YASKAWA ELECTRIC CORP 发明人 NITTA YUJI
分类号 B21D24/00;B21J7/30;B29C33/22;B29C45/53;B30B1/42;B30B5/00;(IPC1-7):B29C45/53 主分类号 B21D24/00
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