| 摘要 |
A device having an improved heat dissipation includes: a panel assembly, a chassis base to support the panel assembly, a circuit substrate coupled to the chassis base, a flexible printed cable, respective ends of which are connected to electrode terminals of the panel assembly and a connector of the circuit substrate, the flexible printed cable transmitting electrical signals therebetween, and a heat radiator to dissipate heat generated by an IC and mounted on the chassis base on which the IC of the flexible printed cable is attached. The device can rapidly dissipate heat generated by an IC during operation since a heat radiator is disposed on one end of the chassis base corresponding to the IC of the flexible printed cable. Accordingly, an operating temperature of the IC can be maintained at an appropriate level, thereby improving the reliability of the IC.
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