发明名称 |
CIRCUIT FORMING BOARD AND METHOD OF MANUFACTURING CIRCUIT FORMING BOARD |
摘要 |
<p>In order to improve the adhesion of a circuit to a circuit forming board, a separation film (4) comprising a base film and a coating layer formed on the base film is joined to both the sides of the board (1). When a laser beam (5) is applied to form a throughhole (6) in the board (1), a unified portion (7) of the board (1) and the separation film (4) is formed around the throughhole (6). An energy beam is applied to the whole or a part of the surface of a circuit formed at a circuit forming step to transfer a part of the separation film. Thus, a high density board where the circuit strongly adheres to the board can be realized in the manufacturing process of the circuit forming board. <IMAGE></p> |
申请公布号 |
EP1170983(A4) |
申请公布日期 |
2005.06.01 |
申请号 |
EP20000981676 |
申请日期 |
2000.12.13 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
NISHII, TOSHIHIRO |
分类号 |
H05K1/11;H05K3/00;H05K3/38;H05K3/40;H05K3/46;(IPC1-7):H05K3/40;H05K3/42 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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