发明名称 Microelectronic element having trace formed after bond layer
摘要 An article is provided which includes a structure overlying a face of an element. The structure includes a first metal layer and a wettable metal layer overlying the first metal layer. A conductive trace overlies and contacts at least one of the first metal layer and the wettable metal layer, the trace having a composition different from at least one of the first metal layer and the wettable metal layer.
申请公布号 US2005116344(A1) 申请公布日期 2005.06.02
申请号 US20040977515 申请日期 2004.10.29
申请人 TESSERA, INC. 发明人 HUMPSTON GILES
分类号 B81B7/00;H01L23/48;(IPC1-7):H01L23/48 主分类号 B81B7/00
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