发明名称 |
Package map data outputting circuit of semiconductor memory device and method for outputting package map data |
摘要 |
The invention relates to a package map data outputting circuit of a semiconductor memory device embedded with a test circuit and a method for the same. In order to improve the reliability of package map data and easily output a greater amount of package map data, package map data is stored to package map data registers at the wafer level and then output through the test circuit at the package level.
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申请公布号 |
US2005117417(A1) |
申请公布日期 |
2005.06.02 |
申请号 |
US20050030522 |
申请日期 |
2005.01.06 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK YONG-DAE;LEE KWANG-JIN |
分类号 |
G11C5/00;G11C29/00;G11C29/48;(IPC1-7):G11C7/00 |
主分类号 |
G11C5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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