发明名称 METHOD FOR FORMING MULTILAYER RESIST
摘要 <p>Disclosed is a method for forming a multilayer resist having sufficient antireflection effect in a photolithography process wherein light in the vacuum ultraviolet range is utilized, and sufficient development characteristics in a developing process. The method for forming a multilayer resist comprising a step (I) for forming a photoresist layer (L1) on a substrate, and a step (II) for forming an antireflective layer (L2) on the photoresist layer (L1) by applying thereto a coating composition containing a fluorine-containing polymer (A) having a hydrophilic group Y, is characterized in that the fluorine-containing polymer (A) has a structural unit derived from a fluorine-containing ethylenic monomer having a hydrophilic group Y, and further characterized in that (i) a hydrophilic group Y of the fluorine-containing polymer (A) contains an acidic OH group having a pKa of not more than 11, (ii) the fluorine content of the fluorine-containing polymer (A) is not less than 50 mass%, and (iii) the mole number of the hydrophilic group Y in 100g of the fluorine-containing polymer (A) is not less than 0.14.</p>
申请公布号 WO2005050320(A1) 申请公布日期 2005.06.02
申请号 WO2004JP16937 申请日期 2004.11.15
申请人 DAIKIN INDUSTRIES, LTD.;ARAKI, TAKAYUKI;KOH, MEITEN;SATO, KAZUYUKI;OHASHI, MIHOKO;KISHIKAWA, YOSUKE 发明人 ARAKI, TAKAYUKI;KOH, MEITEN;SATO, KAZUYUKI;OHASHI, MIHOKO;KISHIKAWA, YOSUKE
分类号 C08F216/12;C09D133/14;C09D133/16;G03F7/004;G03F7/09;G03F7/11;(IPC1-7):G03F7/11 主分类号 C08F216/12
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