| 发明名称 |
Carrier substrate for semiconductor multilayer strcuture and method of manufacturing semiconductor chips |
| 摘要 |
<p>A substrate layer (1) for the manufacture of a semiconductor chip incorporates a layer of electrical insulation (2) containing a ceramic- or aluminum nitride (AIN)-ceramic material.</p> |
| 申请公布号 |
EP1536466(A2) |
申请公布日期 |
2005.06.01 |
| 申请号 |
EP20040026487 |
申请日期 |
2004.11.08 |
| 申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
GROETSCH, STEFAN;ILLEK, STEFAN;PLOESSL, ANDREAS;HAHN, BERTHOLD |
| 分类号 |
H01L23/13;H01L23/15;H01L23/367;H01L23/373;H01L33/00;H01L33/62;H01L33/64;H01S5/02;H01S5/183;(IPC1-7):H01L23/373 |
主分类号 |
H01L23/13 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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