| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding apparatus capable of heating efficiently and uniformly a chip held by a heating head. <P>SOLUTION: The constitution of the bonding apparatus used when mounting in a flip-chip mode a chip 8 on a mounting body 11 includes a heating head 4 having a holding portion 7 for holding the chip 8 thereunder; a stage 9 for holding the mounting body 11 in the state of it being opposed to the chip 8 held by the heating head 4; and a covering member 12 for surrounding the heating head 4 in the state of making the holding portion 7 intrinsic above the stage 9. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
