PLATING JIG FOR ELECTRONIC PARTS AND ELECTROLYSIS PLATING APPARATUS

摘要

The invention aims to provide a plating fixture for an electronic component where each tip face in the leads and earth leads of a plurality of electronic components can be securely abutted on a cathode, and the undeposition of plating and the abnormality of color tones generated at the leads and earth leads can be suppressed. The plating fixture is equipped with: a metallic mesh-shaped cathode 32having opening narrower than each tip size of the leads 16 and earth leads 18 and provided at the place in which each tip of leads 16 and earth leads 18 is abutted; a cylindrical part with each header10 inserted, which guides each tip face of the leads 16 and earth leads 18 to the mesh-shaped cathode 32, and through which an electroplating solution flows so as to press the headers 10 and to presseach tip of the leads 16 and earth leads 18 against the mesh-shaped cathode 32; and an anode provided so that the headers 10 are located in the space between the cylindrical part and the mesh-shapedcathode 32.