发明名称 Semiconductor device and method of fabricating the same
摘要 According to the present invention, there is a provided a semiconductor device fabrication method having, forming a mask material in a surface portion of a semiconductor substrate, and forming a step having a projection by using the mask material; forming a dielectric film on the semiconductor substrate so as to fill the step and planarize an entire surface; annealing the dielectric film; etching back the dielectric film such that a surface of the dielectric film is positioned between upper and lower surfaces of the mask material; and removing the mask material to expose a surface of the projection of the semiconductor substrate.
申请公布号 US2005116300(A1) 申请公布日期 2005.06.02
申请号 US20040804159 申请日期 2004.03.19
申请人 HIEDA KATSUHIKO;KIYOTOSHI MASAHIRO 发明人 HIEDA KATSUHIKO;KIYOTOSHI MASAHIRO
分类号 H01L21/76;H01L21/312;H01L21/314;H01L21/316;H01L21/335;H01L21/762;H01L27/08;(IPC1-7):H01L21/335 主分类号 H01L21/76
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