发明名称 |
Circuit board having test coupon and method for evaluating the circuit board |
摘要 |
A circuit board includes: a substrate; a conductive pattern disposed on a surface of the substrate; a lower insulation layer disposed on the conductive pattern to cover the conductive pattern except for an opening, through which the conductive pattern is partially exposed from the lower insulation layer; a conductor disposed on the lower insulation layer and connecting to the conductive pattern through the opening; an upper insulation layer disposed on the conductor for covering the conductor and the lower insulation layer; and a test coupon disposed on the substrate for evaluating the conductor.
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申请公布号 |
US2005116224(A1) |
申请公布日期 |
2005.06.02 |
申请号 |
US20040983977 |
申请日期 |
2004.11.09 |
申请人 |
MIYAGAWA TOMOYUKI;SHIRATSUCHI TOSHIHARU;TANOOKA ISAO;SUGIURA HIDEAKI |
发明人 |
MIYAGAWA TOMOYUKI;SHIRATSUCHI TOSHIHARU;TANOOKA ISAO;SUGIURA HIDEAKI |
分类号 |
H01L23/58;H05K1/02;H05K3/00;H05K3/28;H05K3/46;(IPC1-7):H01L23/58 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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