发明名称 Circuit board having test coupon and method for evaluating the circuit board
摘要 A circuit board includes: a substrate; a conductive pattern disposed on a surface of the substrate; a lower insulation layer disposed on the conductive pattern to cover the conductive pattern except for an opening, through which the conductive pattern is partially exposed from the lower insulation layer; a conductor disposed on the lower insulation layer and connecting to the conductive pattern through the opening; an upper insulation layer disposed on the conductor for covering the conductor and the lower insulation layer; and a test coupon disposed on the substrate for evaluating the conductor.
申请公布号 US2005116224(A1) 申请公布日期 2005.06.02
申请号 US20040983977 申请日期 2004.11.09
申请人 MIYAGAWA TOMOYUKI;SHIRATSUCHI TOSHIHARU;TANOOKA ISAO;SUGIURA HIDEAKI 发明人 MIYAGAWA TOMOYUKI;SHIRATSUCHI TOSHIHARU;TANOOKA ISAO;SUGIURA HIDEAKI
分类号 H01L23/58;H05K1/02;H05K3/00;H05K3/28;H05K3/46;(IPC1-7):H01L23/58 主分类号 H01L23/58
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