| 摘要 |
PROBLEM TO BE SOLVED: To improve the affection of characteristics loss or the like by a method wherein the reduction of a wiring density and the shortening of length of a wire bonding are permitted without complicating wire bonding wiring between a pad and a lead frame, while permitting the provision of a bonding pad on all of the sides of a semiconductor element with respect to a multi-chips package module structure which mounts a plurality of pieces of semiconductor elements in the same package, and, further, the rise of a resistance is prevented from a semiconductor element pad to an external lead terminal. SOLUTION: Respective semiconductor elements 2, 3 are arrayed in zigzag so that respective sides will not be opposed mutually as the mounting configuration of two pieces of semiconductor elements 2, 3 mounted in the same package, while respective sides of the semiconductor elements 2, 3 are arranged so as to be in parallel to the arraying direction of the external lead terminals in order to avoid the complication of the wire bonding wiring. COPYRIGHT: (C)2005,JPO&NCIPI |
