| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively produce a head module while enhancing high positional accuracy of a nozzle forming surface between head chips, and to eliminate leakage of liquid due to thermal stress. SOLUTION: The head module comprises a head chip 20 arranged with heating resistors 22, a nozzle sheet 13 on which nozzles 13a are formed, a barrier layer 12 for forming an ink liquid chamber 14, a module frame 11 for supporting the nozzle sheet 13 by being stuck thereto and provided with a hole 11b for arranging the head chip 20, and a buffer tank 15 for covering the head chip arranging hole 11b by being bonded to the surface of the module frame 11 opposite to the side being stuck to the nozzle sheet 13 and forming a common liquid channel 15a communicating with all liquid chambers 14 of the head chip 20 wherein the module frame 11 and the buffer tank 15 have a substantially equal linear expansion coefficient. COPYRIGHT: (C)2005,JPO&NCIPI |
