Ceramic circuit board and power module

摘要

In a ceramic circuit board (10) having a ceramic substrate (12) and a metal circuit plate (14) bonded to one surface of the ceramic substrate (12), assuming that the warpage of the ceramic circuit board (10) is a difference in height between the center and edge of the metal circuit plate (14) and is positive (+) when the circuit board warps so as to be concave on the side of the metal circuit plate (14), the warpage of the ceramic circuit board (10) is in the range of from -0.1 mm to +0.3 mm when the ceramic circuit board (10) is heated to 350 DEG C, and in the range of from +0.05 mm to +0.6 mm when the temperature of the ceramic circuit board (10) is returned to a room temperature after the ceramic circuit board (10) is heated to 350 DEG C. The initial warpage of the ceramic circuit board (10) is in the range of from +0.05 mm to +0.6 mm.