| 发明名称 |
HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION |
| 摘要 |
<p>Disclosed is a negative type photosensitive resin composition comprising (A) a polyamide having a photopolymerizable unsaturated double bond, (B) a monomer having a photopolymerizable unsaturated double bond, (C) a photopolymerization initiator and (D) a melamine resin.</p> |
| 申请公布号 |
EP1536286(A1) |
申请公布日期 |
2005.06.01 |
| 申请号 |
EP20030741329 |
申请日期 |
2003.07.10 |
| 申请人 |
ASAHI KASEI EMD CORPORATION |
发明人 |
KANATANI, RYUICHIRO;KIMURA, MASASHI;MARUYAMA, KIMIYUKI |
| 分类号 |
G03F7/035;G03F7/038;(IPC1-7):G03F7/038;G03F7/027;G03F7/004;C08G73/06 |
主分类号 |
G03F7/035 |
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