Filling wafer level packages with liquid,申请号GB20040024351-传众专利搜索

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发明名称	Filling wafer level packages with liquid
摘要
申请公布号	GB2408629(A)	申请公布日期	2005.06.01
申请号	GB20040024351	申请日期	2004.11.03
申请人	* HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.	发明人	BRADLEY * BOWER;QUAN * QI;KIRBY * SAND
分类号	B81C1/00;H01L21/00;H01L21/44;H01L21/54;H01L21/683;H01L23/22;(IPC1-7):H01L21/00	主分类号	B81C1/00
代理机构		代理人
主权项
地址

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