发明名称 |
MICROCHIP WITH THERMAL STRESS RELIEF MEANS |
摘要 |
A packaged microchip has a stress sensitive microchip having a microchip coefficient of thermal expansion, a package having a package coefficient of thermal expansion, and an isolator having an isolator coefficient of thermal expansion. The isolator is connected between the stress sensitive microchip and the package. The microchip coefficient of thermal expansion illustratively is closer to the isolator coefficient of thermal expansion than it is to the package coefficient of thermal expansion. |
申请公布号 |
EP1534624(A1) |
申请公布日期 |
2005.06.01 |
申请号 |
EP20030752017 |
申请日期 |
2003.09.04 |
申请人 |
ANALOG DEVICES, INC. |
发明人 |
HARNEY, KIERAN, P.;LONG, LEWIS |
分类号 |
G01P9/04;B81B3/00;B81B7/00;G01C19/56;G01P15/08;H01L21/58;H01L23/00;H01L23/08;H01L23/16 |
主分类号 |
G01P9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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