| 摘要 |
The present invention provides a printed circuit board whose insulating layer is not melt-adhered to a heating tool, to thereby enhance reliability and productivity of a semiconductor chip mounting line, and also provides a method of producing the printed circuit board. The printed circuit board contains a flexible printed wiring board and a semiconductor chip mounted on the flexible printed wiring board, wherein the flexible printed wiring board includes: an insulating layer 12 and a wiring pattern 21 formed of a conductor layer 11 provided on at least one side of the insulating layer 12 and a releasing layer 13 provided on a surface of the insulating layer 12 , which surface is opposite to the mounting side of the semiconductor chip.
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