发明名称 Method of holding substrate and substrate holding system
摘要 A method and system of holding a substrate to decrease foreign substances on the back surface thereof. The substrate holding system includes a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface thereof to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts a cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact each other in the large portion of the remaining area.
申请公布号 US6899789(B2) 申请公布日期 2005.05.31
申请号 US20030437309 申请日期 2003.05.14
申请人 HITACHI, LTD. 发明人 TAMURA NAOYUKI;TAKAHASHI KAZUE;ITO YOUICHI;OGAWA YOSHIFUMI;SHICHIDA HIROYUKI;TSUBONE TSUNEHIKO
分类号 H01L21/00;H01L21/68;H01L21/683;(IPC1-7):H05H1/00;C23C16/00;C23F1/00 主分类号 H01L21/00
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