发明名称 |
Optical receiver package |
摘要 |
A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor one the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount. |
申请公布号 |
US6900509(B2) |
申请公布日期 |
2005.05.31 |
申请号 |
US20030665660 |
申请日期 |
2003.09.19 |
申请人 |
AGILENT TECHNOLOGIES, INC. |
发明人 |
GALLUP KENDRA;BAUGH BRENTON A.;WILSON ROBERT E.;MATTHEWS JAMES A.;WILLIAMS JAMES H. |
分类号 |
H01L31/02;G02B6/36;H01L21/00;H01L23/02;H01L27/14;H01L29/84;H01L31/0203;H01L31/0232;H01S5/022;H04B10/02;(IPC1-7):H01L29/84 |
主分类号 |
H01L31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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