SOLDER MATERIAL AND ELECTRONIC PART USING THE SAME

摘要

THIS INVENTION PROVIDES A LEAD-FREE HIGH TEMPERATURE SOLDER MATERIAL COMPRISING 0.005-3.0 WT OF PALLADIUM (PD) AND 97.0-99.995 WT OF TIN (SN) WHOSE LIQUIDS TEMPERATURE IS 200-350°C. THE SOLDER MATERIAL IS ENVIRONMENTALLY-FRIENDLY, IMPROVED IN THERMAL FATIGUE PROPERTY, AND IT CAN IMPROVE THE RELIABILITY OF ELECTRONIC APPARATUSES. A PREDETERMINED AMOUNT OF SN MATERIAL AND PD IS MIXED, VACUUM-MELTED AND CAST TO PREPARE AN INGOT. THE INGOT IS ROLLED TO BE A TAPE THAT IS LATER PRESSED TO OBTAIN A SOLDER PELLET. IN A PREFERABLE COMPOSITION, AT LEAST 95 WT OF SN AND 0.005-3.0 WT 5 OF PD ARE CONTAINED, AND 0.1-5.0 WT OF METALLIC (E.G. CU, NI) OR ALLOY PARTICLES ARE ADDED. THE AVERAGE PARTICLE IS ABOUT 40 µM. A SUBSTRATE AND AN IC CHIP (5) ( ELECTRONIC ELEMENT) ARE DIE-BONDED SUBSTANTIALLY IN PARALLEL BY A SOLDER MATERIAL (3) PROVIDED BETWEEN AN NI PLATING (4) ON THE LOWER SIDE OF AN IC CHIP (SEMICONDUCTOR) (5) AND AN NI PLATING (2) ON A DIE (1).(FIG. 1)