发明名称 |
Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates |
摘要 |
An apparatus for flattening sintered ceramic electronic packaging substrates having opposing faces with undesired camber interleaves the substrates with spacers. At least one heating zone includes a heat transfer medium movable toward and away from the stack of interleaved ceramic substrates and spacers to apply a desired rate of heat by direct contact with or close proximity to sides of the stack. A plunger applies pressure to the stack in a direction normal to the faces of the substrates. At least one cooling zone includes a heat transfer medium movable toward and away from the stack to remove heat introduced in the heating zone by direct contact with or close proximity to sides of the stack. A reducing gas supply is operatively connected to the at least one heating zone and at least one cooling zone to supply gas to maintain a controlled reducing atmosphere within the apparatus.
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申请公布号 |
US6900073(B2) |
申请公布日期 |
2005.05.31 |
申请号 |
US20030249429 |
申请日期 |
2003.04.08 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BEZAMA RASCHID J.;WEISMAN RENEE L. |
分类号 |
H05K3/22;H01L21/48;H01L23/12;(IPC1-7):H01L21/44 |
主分类号 |
H05K3/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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