PROCEDURE FOR THE FIXATION OF CHIP CARRIERS

摘要

The method involves stamping conducting tracks (1) onto a metal foil, applying the chip (4) to the resulting tracks, contacting it with bonded wires and embedding it. The chip bearer with the chip is covered by an insulating material, preferably the sealing material, so as to hold the chip bearer and chip in position on the foil when all metal contacts between the foil and chip bearer have been broken.