发明名称 |
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE |
摘要 |
<p>A semiconductor package is disclosed. The package includes a substrate; a semiconductor die attached to the substrate; a housing part attached to the substrate and arranged to surround the semiconductor die; and solidified moulding material arranged around the housing and adhering to the substrate to secure the housing in position on the substrate. A method of manufacturing the package is also disclosed. <IMAGE></p> |
申请公布号 |
SG111092(A1) |
申请公布日期 |
2005.05.30 |
申请号 |
SG20020006897 |
申请日期 |
2002.11.15 |
申请人 |
STMICROELECTRONICS PTE LTD |
发明人 |
LOO KUM-WENG;KHO CHEK LIM |
分类号 |
G01L9/00;H01L23/02;H01L23/04;H01L23/28;H01L23/473;H01L31/0203;H01L31/0232;H01L31/024;(IPC1-7):H01L23/28 |
主分类号 |
G01L9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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