Micro-pump for integrated circuit cooling device e.g. heat sink, has flexible membrane that deforms or not when it contacts/separated from conducting layer and when voltage is applied or not by control circuit, respectively

摘要

The micro-pump has a flexible membrane (6) that deforms when it contacts a conducting layer (3) and when a control circuit (V) applies a voltage. The volume of air pocket located between the membrane and the layer decreases when the membrane is deformed in order to displace air towards an air duct (4). The membrane is separated from the layer when the circuit stops applying the voltage. Independent claims are also included for the following: (a) an integrated circuit having a micro-pump (b) a method for forming a micro-pump in the integrated circuit (c) a method for actuating a micro-pump.