| 发明名称 |
Improvements in or relating to solders |
| 摘要 |
<p>A method of preparing a substantially lead-free solder comprises the step of mixing tin, silver, indium and copper in proportions such as 91.3% tin, 4.2% silver, 4% indium and 0.5% copper.</p> |
| 申请公布号 |
NZ530220(A) |
申请公布日期 |
2005.05.27 |
| 申请号 |
NZ20020530220 |
申请日期 |
2002.01.22 |
| 申请人 |
QUANTUM CHEMICAL TECHNOLOGIES (S'PORE) PTE LTD |
发明人 |
CHEW, KAI HWA;PAN, WEI CHIH |
| 分类号 |
B23K35/26;C22C13/00;(IPC1-7):B23K35/26 |
主分类号 |
B23K35/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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