发明名称 |
Lead Frame, Semiconductor Device Using the Same and Method of Producing the Semiconductor Device |
摘要 |
A lead frame of the present invention includes a pair of base portions having a substantially flat bottom each. An island portion and electrode portions are partly connected to the tops of the base portions. The lead frame needs a minimum of production cost and promotes dense mounting of semiconductor devices to a circuit board. |
申请公布号 |
KR100491657(B1) |
申请公布日期 |
2005.05.27 |
申请号 |
KR20020029747 |
申请日期 |
2002.05.29 |
申请人 |
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发明人 |
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分类号 |
H01L23/48;H01L23/495;H01L23/31;H01L23/50 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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