| 发明名称 |
Bonding composition with cohesive failure having peelable or repositionable structure for packages |
| 摘要 |
<p>A multilayer film structure that is useful for making resealable packages is disclosed, which comprises a composition containing a hot melt adhesive and a binder that is suitable for cohesive rupture or failure of the hot melt during opening or tearing of the resealable package.</p> |
| 申请公布号 |
NZ525749(A) |
申请公布日期 |
2005.05.27 |
| 申请号 |
NZ20010525749 |
申请日期 |
2001.11.16 |
| 申请人 |
SOPLARIL |
发明人 |
ENGELAERE, JEAN-CLAUDE |
| 分类号 |
B65D65/14;B32B7/12;B32B27/32;B65D65/40;B65D77/20;C08L23/04;C08L23/08;C08L45/00;C08L51/06;C09J109/00;C09J121/00;C09J123/00;C09J123/16;C09J125/10;C09J151/06;C09J153/00;C09J153/02;C09J201/00;(IPC1-7):C09J153/02 |
主分类号 |
B65D65/14 |
| 代理机构 |
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