Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device

摘要

A method and device are provided to realize a structure in which different kinds of chips are three-dimensionally mounted while allowing for proper heat dissipation. A semiconductor package PK 12 in which stacked semiconductor chips 33 a and 33 b are wire-connected is stacked on a semiconductor package PK 11 in which a semiconductor chip 23 is mounted by anisotropic conductive film (ACF) bonding. A carrier substrate 31 is mounted on a carrier substrate 21 in a state where the reverse face of the semiconductor chip 23 is exposed.