发明名称 |
Customized microelectronic device and method for making customized electrical interconnections |
摘要 |
A method and apparatus electrically coupling input/output bond pads that are disposed proximate to one another on a microelectronic device. The apparatus includes a microelectronic device having at least two conductive input/output bond pads electrically coupled to an integrated circuit of the microelectronic device and first and second conductive stud balls bonded to first and second input/output pads, respectively, and a third conductive stud ball bonded to the first and second conductive stud balls. A wire bonding tool in "stud ball" mode is utilized to bond the conductive stud balls. |
申请公布号 |
US2005110139(A1) |
申请公布日期 |
2005.05.26 |
申请号 |
US20030723103 |
申请日期 |
2003.11.26 |
申请人 |
LAM KEN M.;BELL WALTER C. |
发明人 |
LAM KEN M.;BELL WALTER C. |
分类号 |
H01L21/60;H01L23/485;H01L23/525;(IPC1-7):H01L23/48;H01L21/44 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|