| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, a semiconductor module and manufacturing methods for the device and the module improved so that wiring lengths are not, while being lengthened, following a structural concept in which another semiconductor chip is placed directly on the semiconductor chip and turned into multilayers. SOLUTION: In the semiconductor device, the first semiconductor chip 1 and the second semiconductor chip 2, having a shape in a plan view smaller than the chip 1 are laminated under the state in which the chip 2, is mounted on the chip 1 in a flip-chip manner. In the semiconductor device, an insulating resin layer 3, under a state in which the chip 2 is embedded, is formed to the side face of the second semiconductor chip lamination of the chip 1, while conductive members 4 which is electrically conducted with electrodes 1a for the chip 1 are formed to the layer 3, while being penetrated in the thickness direction of the layer 3. COPYRIGHT: (C)2005,JPO&NCIPI
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