| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid state imaging device which effectively increases a manufacture yield while effectively preventing cracks when a solid state imaging device chip is fixed to a package. SOLUTION: The solid state imaging device 100 includes the solid state imaging device chip 101, the package 103 and a lens 104. In the solid state imaging device chip 101, a plurality of photoelectric converting portions 102 are formed on a surface in the shape of the convex curved surface of a semiconductor substrate 105. In the solid state imaging device 100, the chip holding face 103a of the package 103 curves in the shape of a concave curved surface so that a deviation of an image plane may be canceled. The solid state imaging device chip 101 is bonded to the package 103 along the chip holding face 103a in the shape of the concave curved surface. A surface on which the photoelectric converting portions 102 are formed is brought into contact with the chip holding face 103a in the shape of the concave curved surface of the package 103, while the other surface on which the photoelectric converting portions 102 are not formed is constituted to be a photo-detecting face. COPYRIGHT: (C)2005,JPO&NCIPI
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