| 摘要 |
An improved apparatus for handling semiconductor wafers is provided. The semiconductor wafer handling apparatus includes a wafer edge gripping end effector having a paddle substrate with a distal end and a proximal end, a first arcuate wafer contact pad disposed on the substrate at the distal end, and second and third arcuate wafer contact pads disposed on the substrate adjacent the proximal end. Each one of the wafer contact pads includes a first arcuate surface and a second beveled surface for engaging an edge of a wafer. The end effector further includes a movable wafer gripping finger disposed on the substrate between the second and third wafer contact pads. The movable finger has a first arcuate surface for contacting the wafer edge, and for pushing the wafer edge against the first wafer contact pad, thereby securing the wafer on the substrate.
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