发明名称 Light-emitting semiconductor device and method of fabrication
摘要 A light-emitting diode having a silicon substrate on which there are successively formed a buffer layer, a p-type nitride semiconductor layer, an active layer, an n-type nitride semiconductor layer, and a current spreading layer. The current spreading layer is a lamination of a first and a second sublayer arranged alternately a required number of times. Composed of different compound semiconductors, the alternating sublayers of the current spreading layer create heterojunctions for offering the two-dimensional gas effect. The current spreading layer is so low in resistivity in a direction parallel to its major surface from which light is emitted, that the current is favorably spread therein for improved efficiency of light emission. A front electrode in the form of a metal pad is mounted centrally on the major surface of the current spreading layer in ohmic contact therewith.
申请公布号 US2005110029(A1) 申请公布日期 2005.05.26
申请号 US20040994922 申请日期 2004.11.22
申请人 AOYAGI HIDEKAZU;OTSUKA KOJI;SATO MASAHIRO 发明人 AOYAGI HIDEKAZU;OTSUKA KOJI;SATO MASAHIRO
分类号 H01L33/00;H01L33/04;H01L33/14;(IPC1-7):H01L33/00 主分类号 H01L33/00
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