发明名称 |
METHOD FOR INTEGRATING PRE-FABRICATED CHIP STRUCTURES INTO FUNCTIONAL ELECTRONIC SYSTEMS |
摘要 |
<p>A method for manufacturing integrated objects, e.g., electronic devices, biological devices. The method includes providing a holder substrate, which has at least one recessed region, the recessed region having a predetermined shape. The holder substrate has a selected thickness and is characterized as being substantially rigid in shape. The method includes aligning a chip comprising a face and a backside into the predetermined shape of the recessed region and disposing the chip into the recessed region. The chip is secured into the recessed region. The method includes providing a first film of insulating material having a first thickness overlying the face and portions of the holder substrate to attach the chip to a portion of the first film of insulating material and patterning the first film of insulating material to form at least one opening through a portion of the first thickness to a contact region on the face of the chip. The method includes forming a metallization layer overlying the first film of insulating material to couple to the contact region through the one opening and forming a protective layer overlying the metallization layer. The method includes releasing the chip from the holder substrate while maintaining attachment of the chip to the first film of insulating material.</p> |
申请公布号 |
WO2005048302(A2) |
申请公布日期 |
2005.05.26 |
申请号 |
WO2004US36048 |
申请日期 |
2004.10.29 |
申请人 |
CALIFORNIA INSTITUTE OF TECHNOLOGY;TAI, YU-CHONG;RODGER, DAMIEN, C. |
发明人 |
TAI, YU-CHONG;RODGER, DAMIEN, C. |
分类号 |
H01L;H01L21/44;H01L21/60;H01L21/68;H01L23/538;H01L29/40;(IPC1-7):H01L/ |
主分类号 |
H01L |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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