| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a solder-coated ball having an Sn-based solder layer which inhibits the release of a gas when heated and melted. SOLUTION: This manufacturing method comprises the steps of: preparing a spherical core; forming the solder layer so as to surround the core, by using a plating solution including Sn with an electrolytic plating method; and heat-treating the core having the solder layer, in order to reduce a content of a predetermined organic matter in the solder layer into a specified quantity or less, while the predetermined organic matter forms chemical species having a mass-to-charge ratio (m/z) of 100 or more in a TDS test. COPYRIGHT: (C)2005,JPO&NCIPI |
