| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has high adhesion strength to a lead frame and excels in soldering resistance, and a semiconductor device. SOLUTION: The semiconductor sealing epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) 2-amino-4,6-dimercapto-s-triazine. More preferably, the semiconductor sealing epoxy resin composition comprises the 2-amino-4,6-dimercapto-s-triazine in an amount of 0.004-2 wt.% based on the resin composition. The semiconductor device is obtained by sealing a semiconductor element with the use of these epoxy resin compositions. COPYRIGHT: (C)2005,JPO&NCIPI |
