发明名称 SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To solve such problems that cracks or the like are easy to occur to the peripheral part of a through hole by the stress exerted in screwing down or when used, as the through hole for screwing down or the like is formed in a substrate comprising a composite of graphite and a metal, and permit the thinning of it. SOLUTION: In a substrate comprising a composite of graphite and a metal, the substrate has a through hole connecting both principal planes. The substrate satisfies the relationship of D(2T-1)-2WT≤0, expressing the diameter of the through hole as D mm, the thickness of the heat dissipating substrate as T mm, and the minimum distance from the side of the heat dissipating substrate to the through hole as W mm. Moreover, the substrate has the through hole connecting both principal planes in the substrate comprising a complex of graphite and a metal. The substrate is formed with a pipe member, for example the pipe member provided with slits and notches, fitted in the inner peripheral portion of the through hole. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005136369(A) 申请公布日期 2005.05.26
申请号 JP20040030722 申请日期 2004.02.06
申请人 HITACHI METALS LTD 发明人 FUKUSHIMA HIDEKO;OKITA HIROYUKI
分类号 H01L23/36;(IPC1-7):H01L23/36 主分类号 H01L23/36
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