| 摘要 |
A microelectromechanical fluid ejection device is formed upon a wafer upon which an interconnect layer is disposed. The fluid ejection device includes a number of fluid passageways that are produced by firstly forming a bore through the interconnect layer, from the interconnect layer side, to a depth that is greater than the interface. A second bore is back-etched through the underside of the wafer. The first and second bores meet to form the fluid passageway. Fabricating the ejection device in accordance with the disclosed method avoids etchant traveling along the interface and potentially damaging CMOS circuits located at the interface.
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