Semiconductor device and method of manufacturing the same, circuit board, and electronic apparatus

摘要

A semiconductor device is provided that comprises: a first semiconductor package including a first substrate having a first pad; a second semiconductor package including a second substrate having a second pad which is mounted on the first semiconductor package; and solder provided between the first and second substrates that electrically couples each of the first pads and each of the second pads. Only the solder at the corner portions of the first substrate is covered with resin.