发明名称 DETACHABLE ON PACKAGE VOLTAGE REGULATION MODULE
摘要 An integrated circuit (IC) package that includes an on-package voltage regulation module (VRM). An IC die is flip­bounded to a substrate having a plurality of connections to couple to a socket or to be mounted directly to a circuit board. An integrated heat spreader (IHS) is thermally coupled to the IC die and coupled (both electrically and mechanically) to the substrate. A VRM is coupled to the IHS. The IHS, which serves as an interconnect member, includes interconnect provisions for electrically coupling the VRM to the substrate. In one embodiment, the body of the IHS serves as a ground plane, while a separate interconnect layer includes electrical traces for routing electrical signals between the VRIVI and substrate. The VRM may comprise a detachable package that is coupled to the IHS via one of several means including fasteners, edge connectors and a parallel coupler.
申请公布号 WO2005048323(A2) 申请公布日期 2005.05.26
申请号 WO2004US35997 申请日期 2004.10.28
申请人 INTEL CORPORATION;MALLIK, DEBENDRA;PATEL, PRIYAVADAN 发明人 MALLIK, DEBENDRA;PATEL, PRIYAVADAN
分类号 G06F1/26;H01L23/12;H01L23/36;H01L23/367;H05K1/02;H05K1/18 主分类号 G06F1/26
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