发明名称 |
COMPONENTS, METHODS AND ASSEMBLIES FOR MULTI-CHIP PACKAGES |
摘要 |
An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer (350) having arranged on a top surface (351) and a bottom surface (352) thereof a number of packaged semiconductor chips (315, 320, 325, 330) mounted via solder bumps (335) in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP. |
申请公布号 |
WO2004034434(A9) |
申请公布日期 |
2005.05.26 |
申请号 |
WO2003US32078 |
申请日期 |
2003.10.10 |
申请人 |
TESSERA, INC. |
发明人 |
KIM, YOUNG-GON;GIBSON, DAVID;WARNER, MICHAEL;DAMBERG, PHILIP;OSBORN, PHILIP |
分类号 |
H01L25/10;H05K1/14;H05K3/34 |
主分类号 |
H01L25/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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