发明名称 |
Sealing method for electronic devices formed on a common semiconductor substrate and corresponding circuit structure |
摘要 |
A method for sealing electronic devices formed on a semiconductor substrate includes forming at least one first conductive layer on a first portion of the semiconductor substrate for defining electronic devices, and forming a second conductive layer on a second portion of semiconductor substrate for also defining electronic devices. First regions are formed in the at least one first conductive layer for defining electronic devices, and a first sealing layer is formed on the whole semiconductor substrate to seal the first regions. Second regions are formed in the second conductive layer for defining electronic devices, and a second sealing layer is formed on the whole semiconductor substrate to seal the second regions. |
申请公布号 |
US2005112905(A1) |
申请公布日期 |
2005.05.26 |
申请号 |
US20040971774 |
申请日期 |
2004.10.22 |
申请人 |
STMICROELECTRONICS S.R.I. |
发明人 |
CAMERLENGHI EMILIO;MAURELLI ALFONSO;PESCHIAROLI DANIELA;ZABBERONI PAOLA |
分类号 |
H01L21/8234;H01L21/8247;H01L23/31;H01L27/105;(IPC1-7):H01L21/44;H01L21/469;B32B7/12;H01L21/48;B32B15/04;H01L21/50;H01L21/31 |
主分类号 |
H01L21/8234 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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