| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad having a combination of improved information to produce a flattened wafer with a low defect factor, considering that the performance for defect factor becomes a sacrifice when using a polishing pad producing a good flatness, or, the performance for flattening becomes a sacrifice when using a polishing pad producing a low defect factor. <P>SOLUTION: The polishing pad is useful in flattening a semiconductor base material. The polishing pad contains a polymer material which has a porosity of at least 0.1 vol.%, a KEL(kinetic energy loss) energy loss factor of 385 to 750 l/Pa at 40°C and 1 rad/sec, and an elastic modulus E' of 100 to 400 MPa at 40°C and 1 rad/sec. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
