| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve heat dissipation characteristics and simplify a wire bonding process by improving the shape of a common-use lead frame. <P>SOLUTION: The common-use lead frame 20 is formed in an integral and continuous shape. A strip 26 which becomes an external extraction terminal 15 on the cathode (K) side after cutting tie bars, and a wide portion 25 which eventually becomes a heat slinger 12 of a resin sealed semiconductor device 11 whereon a semiconductor chip 3 is mounted and secured, are not separated from each other. By this structure, the wire bonding of the K-side external extraction terminal 15 and a top electrode of the semiconductor chip 3 is not necessary, and heat dissipation characteristics can be improved. In a mid point between a bonding post formation section 28 which becomes an external extraction terminal 14 on the anode (A) side and the strip 26, a temporary terminal 29 is located, and the tip of the temporary terminal 29 is sunk into an eventually formed resin seal 18 by a predetermined amount, thereby preventing the leakage of molten resin outside even if a common-use metal mold for resin sealing is used. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
