| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a printed circuit board provided with a high-resolution metal wiring pattern. <P>SOLUTION: This manufacturing method of the printed circuit board consists of a process of preparing a photosensitive transfer sheet obtained by laminating a first photosensitive layer of low sensitivity and a second photosensitive layer of high sensitivity are laminated on a support body; and a board for forming the printed circuit board which has a through hole and whose surface is covered with a metal layer having a surface roughness of 0.01 to 0.40 μm, a laminating process of pressing the photosensitive transfer sheet to the surface of the board so that a second photosensitive layer may contact with it, a process of irradiating the wiring pattern forming area of the board from the supporter side of a laminated body with light of a light quantity which hardens the second photosensitive layer and irradiating an area including the opening part of the through hole of the board with light of a light quantity which cures both of the first photosensitive layer and the second photosensitive layer to form a hard layer area, a lifting process of the supporter, a development process for melting and removing a photosensitive layer area which is not cured yet, an etching process of the metal layer, and a removing process of a cured layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
