| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape carrier and a manufacturing method thereof, wherein in conventional methods for producing a via (opening) by using a punching process, a solder constriction phenomenon and a ball-dropping phenomenon can be decreased. SOLUTION: A tape carrier 100 comprises an insulating substrate 10 and the via (opening) 33 of a staircase structure on one face, and the insulating substrate 10 is obtained by laminating an insulating base film 11, having the opening 31 of an opening diameter R<SB>1</SB>and an insulating base film 12 having the opening 32 of an opening diameter R<SB>2</SB>, and is formed with a ball land 41a and a wiring layer on the other face. Further, a tape carrier 200 is formed with a solder resist layer 51 on the ball land 41a and the wiring layer of the tape carrier 100, and nickel and a gold membrane on the ball land in the via (opening) 33 of the staircase structure. COPYRIGHT: (C)2005,JPO&NCIPI |
