发明名称 THERMOFORMING MOLD AND THERMOFORMING METHOD OF RESIN SHEET
摘要 PROBLEM TO BE SOLVED: To provide a thermoforming mold capable of obtaining a molded product excellent in transparency, glossiness and shaping properties without accompanying the lowering of a molding cycle or the additional consumption of energy in performing a thermoforming method. SOLUTION: In the thermoforming mold for performing the thermoforming of a resin sheet so as to provide distribution in heating temperature by providing a low temperature part being a part wherein transparent surface properties are required after shaping and a high temperature part being a part wherein transparent surface properties are not required after shaping, a low temperature contact part coming into contact with the low temperature part of the resin sheet and a high temperature contact part bringing a mold into contact with the high temperature part of the resin sheet are thermally connected by a heat conductive member. Since the high and low temperature contact parts of the mold are thermally connected by the heat conductive member, the heat of the high temperature contact part can be efficiently transmitted to the low temperature contact part. Accordingly, high moldability can be held without bringing about the lowering of the molding cycle or an increase in cost by newly performing heating and a molded product excellent in transparency, glossiness and shaping properties can be obtained. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005131857(A) 申请公布日期 2005.05.26
申请号 JP20030368562 申请日期 2003.10.29
申请人 NISSAN MOTOR CO LTD 发明人 ITO TOMOHIRO;KAI YASUAKI;UESUGI KENJI
分类号 B29C51/30;B29C51/10;(IPC1-7):B29C51/30 主分类号 B29C51/30
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