发明名称 Toolless printed circuit carrier assembly
摘要 A printed circuit assembly carrier comprises a carrier frame configured to hold a selected printed circuit assembly of at least two different printed circuit assemblies in at least two different orientations, a first toolless retention feature coupled to a first surface of the carrier frame and configured to retain the selected printed circuit assembly, and a second toolless retention feature coupled to a second surface of the carrier frame and configured to secure the carrier frame in at least one of the orientations.
申请公布号 US2005111198(A1) 申请公布日期 2005.05.26
申请号 US20030721627 申请日期 2003.11.25
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 SUEKAWA MIKE;KIM KWANG;MASADA GWYNN M.
分类号 G06F1/18;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/18
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