发明名称 METHOD AND DEVICE FOR PROCESSING CIRCUIT BOARD USING LASER BEAM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method and device which, with a little additional time and labor, expand processing fields without increasing manufacturing cost of the machines, and which consequently realize improvement in the processing speed. <P>SOLUTION: As for the method, the shape and size of the individual processing fields are matched to the covering surface area of the circle provided by the imaging unit so that the laser beam has a greater surface area than that of the square contained within this circle. As for the device, the rotary range of the mirror in the deflection unit is designed so that the laser beam is guided to each point in the circular imaging area obtainable by the imaging unit. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005131709(A) 申请公布日期 2005.05.26
申请号 JP20040305930 申请日期 2004.10.20
申请人 SIEMENS AG 发明人 KILTHAU ALEXANDER;MAYER HANS JUERGEN
分类号 B23K26/06;B23K26/02;B23K26/08;B23K26/38;B23K101/42;H05K3/00;(IPC1-7):B23K26/06 主分类号 B23K26/06
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